4th WCSET-2015 at Japan

 

Mechanical Engineering:

Title:           Fundamental Experiments of a Vapor Chamber Fabricated on a Plastic Board
(Comparison with a Thermosyphon)
Authors:      Fumihiko Hideyama, Shuto Nonoshita, Yasushi Koito, Toshio Tomimura
Abstract:     A vapor chamber is a flat-plate heat pipe and is used as a heat spreader to spread the heat flux from a small heat source to a large heat sink. Latent heat of evaporation and condensation of a working fluid is utilized inside the vapor chamber, and therefore a large quantity of heat is transported with a small temperature drop. In the previous study, a capillary-wick vapor chamber was fabricated and fundamental experiments were conducted. It utilizes the capillary force of a wick structure to pump back the condensate from a condensation section to an evaporator section. On the other hand in the present study, the thermosyphon type vapor chamber which utilizes gravity is fabricated on the surface of the polycarbonate board. Then fundamental experiments are conducted to compare with the previous capillary-wick vapor chamber and confirm the influence of gravity. The vapor chamber works without any external power in both cases. Water is used as a working fluid. In experiments, the heat is applied by the heater attached to the bottom of the vapor chamber while the top of the vapor chamber is cooled by the cooling water circulated by the thermostatic bath. The transient responses and the steady-state temperature distributions of the vapor chamber are obtained by changing the heat input and the amount of the working fluid. Moreover, a thermal circuit model is made and their effective thermal conductivities are also evaluated. From the experimental results, the heat transfer characteristics of the capillarywick and the thermosyphon type vapor chamber are compared, and then the discussion is made on the optimum thermal design of the polymer-based vapor chamber.

Keywords:   Polymer Vapor Chamber, Latent Heat Transfer, Capillary-wick Structure, Thermosyphon, Effective Thermal Conductivity
Pages:         108-112

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